Core Science | Detailed IC Packaging Terms
1. BGA (ball grid array) ball contact display, one of the surface mount packages. On the back side of the printed circuit board, spherical bumps are produced in the manner of display instead of pins. LSI chips are assembled on the front side of the printed circuit board, and then sealed by molding resin or potting. Also called a bump display carrier (PAC). The pin can exceed 200, which is a package for multi-pin LSI. The package body can also be made smaller than a QFP (Quad Flat Package). For example, a 360-pin BGA with a pin center distance of 1.5mm is only 31mm square; a 304-pin QFP with a 0.5mm pin center distance is 40mm square. And BGA does not have to worry about pin deformation problems like QFP. This package was developed by Motorola in the United States. It was first used in mobile phones and other devices. It may be popularized in the United States in the future. Initially, the center distance of the pins (bumps) of the BGA was 1.5 mm, and the number of pins was 225. There are also some LSI manufacturers currently developing 500-pin BGAs. The problem with BGA is visual inspection after reflow. It is unclear whether an effective visual inspection method is available. Some people believe that due to the large center distance of the welding, the connection can be regarded as stable and can only be handled through functional inspection. Motorola Corporation of the United States refers to the package sealed with molded resin as OMPAC, and the package sealed by potting method is called GPAC (see OMPAC and GPAC).
2. BQFP (quad flat package with bumper). One of the QFP packages, protrusions (buffer pads) are provided at the four corners of the package body to prevent the pins from being deformed during shipping. US semiconductor manufacturers mainly use this package in circuits such as microprocessors and ASICs. The center distance of the pins is 0.635mm, and the number of pins ranges from 84 to 196 (see QFP).
3, butt joint PGA (butt joint pin grid array) Another name for surface mount PGA (see surface mount PGA).
4. C- (ceramic) represents the ceramic package mark. For example, CDIP stands for ceramic DIP. It is a mark often used in practice.
5. Cerdip uses glass sealed ceramic double in-line package for ECL RAM, DSP (digital signal processor) and other circuits. Cerdip with glass window is used for ultraviolet erasing EPROM and microcomputer circuit with EPROM inside. The center of the pins is 2.54mm, and the number of pins is from 8 to 42. In Japan, this package is referred to as DIP-G (G means glass seal).
6. One of Cerquad's surface-mount packages, that is, sealed ceramic QFP, used to package logic LSI circuits such as DSP. Cerquad with window is used to encapsulate EPROM circuits. The heat dissipation is better than plastic QFP, and it can tolerate 1.5 ～ 2W power under natural air cooling conditions. But packaging costs are 3 to 5 times higher than plastic QFP. The center distance of the pins has various specifications such as 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm. The number of pins is from 32 to 368.
7. CLCC (ceramic leaded chip carrier) A ceramic chip carrier with pins, one of the surface-mount packages. The pins are drawn from the four sides of the package and are T-shaped. A window is used to encapsulate ultraviolet erasable EPROM and a microcomputer circuit with EPROM. This package is also called QFJ, QFJ-G (see QFJ).
8. COB (chip on board) chip on board packaging is one of the bare chip mounting technologies. The semiconductor chip is handed over and mounted on the printed circuit board. The electrical connection between the chip and the substrate is achieved by the wire stitching method. Connections are made using a lead stitching method and covered with resin to ensure reliability. Although COB is the simplest bare chip placement technology, it has a packaging density that is far inferior to TAB and flip-chip technology.
9. Double flat package (DFP). It is another name for SOP (see SOP). This term has been used before, but it is basically no longer used.
10.DIC (dual in-line ceramic package) Another name for ceramic DIP (including glass seal) (see DIP).